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Company
TE Connectivity
Description
Mini PCI Express & MSATA
Bill of material
1775862-2
PN
Part Number
CTEPS
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FSCPBN
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DESC
Description
CS
Connector System
SEALABLE
Sealable
CCTT
Connector & Contact Terminates To
Printed Circuit Board
CST
Connector Style
PT
Product Type
PCBMO
PCB Mount Orientation
STACKABLE
Stackable
NR
Number of Rows
NP
Number of Positions
NK
Number of Keys
ET
Ejector Type
EL
Ejector Location
CBM
Contact Base Material
Copper Alloy
PCBCTAPM
PCB Contact Termination Area Plating Material
PCBCTAPMF
PCB Contact Termination Area Plating Material Finish
CUM
Contact Underplating Material
CMAPM
Contact Mating Area Plating Material
CCR
Contact Current Rating (Max)
A
IS
Insertion Style
PCBMS
PCB Mounting Style
PCBMRT
PCB Mount Retention Type
PCBMR
PCB Mount Retention
CP
Center Post
MAT
Mating Alignment Type
BLT
Boardlock Type
BM
Boardlock Material
BPMF
Boardlock Plating Material Finish
BPM
Boardlock Plating Material
LPM
Latch Plating Material
LM
Latch Material
STCPMF
Solder Tail Contact Plating Material Finish
HM
Housing Material
HC
Housing Color
CPMM
Centerline (Pitch)
mm
CPIN
Centerline (Pitch)
in
RRSMM
Row-to-Row Spacing
mm
RRSIN
Row-to-Row Spacing
in
CMAPTM
Contact Mating Area Plating Thickness
µm
CMAPTIN
Contact Mating Area Plating Thickness
µin
HABMM
Height Above PC Board
mm
HABIN
Height Above PC Board
in
SHMM
Stack Height
mm
SHIN
Stack Height
in
MO
Module Orientation
HTH
High Temperature Housing
OTRC
Operating Temperature Range
°C
OTRF
Operating Temperature Range
°F
CA
Circuit Application
ULFR
UL Flammability Rating
BT
Bus Type
CK
Center Key
DRAMT
DRAM Type
DRAMVV
DRAM Voltage
V
BOSS
Boss
PQ
Packaging Quantity
PM
Packaging Method
COMMENT
Comment
Additional Information
Recommendations
Similar parts
Related Equipment
Additional Data
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