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Company
TE Connectivity
Description
1-5645955-1
Bill of material
1-5645955-1
PN
Part Number
1-5645955-1
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TEINTERNAL
TE Internal #
1-5645955-1
TEINTERNALDESCRIPTION
TE Internal Description
SOCKET,MIN-SPR B-N SN-SN SER-2
SLEEVESTYLE
Sleeve Style
Bullet Nose
CONNECTORSYSTEM
Connector System
Cable-to-Board
SEALABLE
Sealable
No
CONNECTORCONTACTTERMINATESTO
Connector & Contact Terminates To
Printed Circuit Board
PRODUCTTYPE
Product Type
Contact
PROFILE
Profile
Zero
WIRECABLETYPE
WireCable Type
Discrete Wire
SLEEVEPLATINGMATERIAL
Sleeve Plating Material
Tin
SLEEVEMATERIAL
Sleeve Material
Copper
CONTACTBASEMATERIAL
Contact Base Material
Beryllium Copper
CONTACTCURRENTRATINGMAXA
Contact Current Rating Max
5 A
CONTACTTYPE
Contact Type
Socket
CONTACTSPRINGPLATINGTHICKNESS
Contact Spring Plating Thickness
2.54 um [ 30 uin ]
CONTACTSPRINGPLATINGMATERIAL
Contact Spring Plating Material
Tin
CONTACTMATINGAREAPLATINGTHICKNESSUM
Contact Mating Area Plating Thickness
2.54 um
CONTACTTRANSMITSTYPICAL
Contact Transmits
Signal (Data)Power Typical
SOCKETTYPE
Socket Type
Discrete
TERMINATIONMETHODTOPRINTEDCIRCUITBOARD
Termination Method to Printed Circuit Board
Through Hole - Press-Fit
TERMINATIONMETHODTOWIRECABLE
Termination Method to Wire & Cable
Solder
INSERTIONMETHOD
Insertion Method
HandSemi-AutomaticAutomatic
SOCKETLENGTH
Socket Length
4.67 mm [ .184 in ]
HOLESIZERECOMMENDED
Hole Size
1.32 mm [ .052 in ] Recommended
WIRESIZEAWG
Wire Size
28 - 22 AWG
WIRESIZEMM2
Wire Size
.081 - .326 mm2
MATINGPINDIAMETERRANGE
Mating Pin Diameter Range
.36 - .66 mm [ .014 - .026 in ]
PCBTHICKNESSRECOMMENDED
PCB Thickness
.79 - 3.18 mm [ .031 - .125 in ] Recommended
OPERATINGTEMPERATURERANGE
Operating Temperature Range
-65 - 125 C [ -85 - 257 F ]
SOLDERPROCESSFEATURE
Solder Process Feature
Anti-Flux
CIRCUITAPPLICATION
Circuit Application
Power & Signal
PACKAGINGMETHOD
Packaging Method
Reel
PACKAGINGQUANTITY
Packaging Quantity
10000
SPRINGMATERIAL
Spring Material
Beryllium Copper
Additional Information
Recommendations
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Additional Data
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