$ {catalogItem}-$ {catalogLabel}

English

CAD모델 선택

사용 가능한 제품: 1

HELP_VARIABLE


Company	TE Connectivity
Description	2-332070-1
Bill of material	2-332070-1
PN Part Number	2-332070-1
CTEPS Contact TE Product Support	CLICK HERE to Contact TE Product Support
FSCPBN Find Specs, Compatible Parts, or Buy Now	CLICK HERE to Find Specs, Compatible Parts, or Buy Now
TEINTERNAL TE Internal #	2-332070-1
TEINTERNALDESCRIPTION TE Internal Description	SOCKET,MIN-SPR SN-AU SER-4
SLEEVESTYLE Sleeve Style	Closed Bottom
CONNECTORSYSTEM Connector System	Cable-to-Board
SEALABLE Sealable	No
CONNECTORCONTACTTERMINATESTO Connector & Contact Terminates To	Printed Circuit Board
PRODUCTTYPE Product Type	Contact
PROFILE Profile	Zero
WIRECABLETYPE WireCable Type	Discrete Wire
SLEEVEPLATINGMATERIAL Sleeve Plating Material	Tin
SLEEVEMATERIAL Sleeve Material	Copper
CONTACTBASEMATERIAL Contact Base Material	Beryllium Copper
CONTACTCURRENTRATINGMAXA Contact Current Rating Max	7.5	A
CONTACTTYPE Contact Type	Socket
CONTACTSPRINGPLATINGTHICKNESS Contact Spring Plating Thickness	.762 um [ 30 uin ]
CONTACTSPRINGPLATINGMATERIAL Contact Spring Plating Material	Gold
CONTACTMATINGAREAPLATINGTHICKNESS Contact Mating Area Plating Thickness	30 um [ 30 uin ]
CONTACTTRANSMITSTYPICAL Contact Transmits	Signal (Data)Power	Typical
SOCKETTYPE Socket Type	Discrete
TERMINATIONMETHODTOPRINTEDCIRCUITBOARD Termination Method to Printed Circuit Board	Through Hole - Press-Fit
TERMINATIONMETHODTOWIRECABLE Termination Method to Wire & Cable	Solder
INSERTIONMETHOD Insertion Method	HandSemi-Automatic
SOCKETLENGTH Socket Length	3.63 mm [ .143 in ]
HOLESIZERECOMMENDED Hole Size	1.83 mm [ .072 in ]	Recommended
WIRESIZEAWG Wire Size	20 - 19	AWG
WIRESIZEMM2 Wire Size	.518 - .653	mm2
MATINGPINDIAMETERRANGE Mating Pin Diameter Range	.86 - .94 mm [ .034 - .037 in ]
PCBTHICKNESSRECOMMENDED PCB Thickness	.79 - 3.18 mm [ .031 - .125 in ]	Recommended
OPERATINGTEMPERATURERANGE Operating Temperature Range	-65 - 125 C [ -85 - 257 F ]
SOLDERPROCESSFEATURE Solder Process Feature	None
CIRCUITAPPLICATION Circuit Application	Power & Signal
PACKAGINGMETHOD Packaging Method	Bag, Loose Piece
PACKAGINGQUANTITY Packaging Quantity	2000
SPRINGMATERIAL Spring Material	Beryllium Copper

지원되는 타사 쿠키 없음

2-332070-1