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50864-1

  1. TE Connectivity
  3. Connectors
  5. Card Edge Connectors & Sockets_new
  7. Pin Sockets
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HELP_VARIABLE
Company
TE Connectivity
Description
50864-1
Bill of material
50864-1
PN
Part Number
50864-1
CTEPS
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FSCPBN
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TEINTERNAL
TE Internal #
50864-1
TEINTERNALDESCRIPTION
TE Internal Description
SOCKET,MIN-SPR SN-AU SER-3
SLEEVESTYLE
Sleeve Style
Closed Bottom
CONNECTORSYSTEM
Connector System
Cable-to-Board
SEALABLE
Sealable
No
CONNECTORCONTACTTERMINATESTO
Connector & Contact Terminates To
Printed Circuit Board
PRODUCTTYPE
Product Type
Contact
PROFILE
Profile
Zero
WIRECABLETYPE
WireCable Type
Discrete Wire
SLEEVEPLATINGMATERIAL
Sleeve Plating Material
Tin
SLEEVEMATERIAL
Sleeve Material
Copper
CONTACTBASEMATERIAL
Contact Base Material
Beryllium Copper
CONTACTCURRENTRATINGMAXA
Contact Current Rating Max
6.5 A
CONTACTTYPE
Contact Type
Socket
CONTACTSPRINGPLATINGTHICKNESS
Contact Spring Plating Thickness
.762 um [ 30 uin ]
CONTACTSPRINGPLATINGMATERIAL
Contact Spring Plating Material
Gold
CONTACTMATINGAREAPLATINGTHICKNESS
Contact Mating Area Plating Thickness
30 um [ 30 uin ]
CONTACTTRANSMITSTYPICAL
Contact Transmits
Signal (Data)Power Typical
SOCKETTYPE
Socket Type
Discrete
TERMINATIONMETHODTOPRINTEDCIRCUITBOARD
Termination Method to Printed Circuit Board
Through Hole - Press-Fit
TERMINATIONMETHODTOWIRECABLE
Termination Method to Wire & Cable
Solder
INSERTIONMETHOD
Insertion Method
HandSemi-AutomaticAutomatic
SOCKETLENGTH
Socket Length
6.53 mm [ .257 in ]
HOLESIZERECOMMENDED
Hole Size
1.57 mm [ .062 in ] Recommended
WIRESIZEAWG
Wire Size
22 - 20 AWG
WIRESIZEMM2
Wire Size
.326 - .518 mm2
MATINGPINDIAMETERRANGE
Mating Pin Diameter Range
.66 - .84 mm [ .026 - .033 in ]
PCBTHICKNESSRECOMMENDED
PCB Thickness
.79 - 3.18 mm [ .031 - .125 in ] Recommended
OPERATINGTEMPERATURERANGE
Operating Temperature Range
-65 - 125 C [ -85 - 257 F ]
SOLDERPROCESSFEATURE
Solder Process Feature
None
CIRCUITAPPLICATION
Circuit Application
Power & Signal
PACKAGINGMETHOD
Packaging Method
Bag, Loose Piece
PACKAGINGQUANTITY
Packaging Quantity
2000
SPRINGMATERIAL
Spring Material
Beryllium Copper
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