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Company
TE Connectivity
Description
5413558-3
Bill of material
5413558-3
PN
Part Number
5413558-3
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TEINTERNAL
TE Internal #
5413558-3
TEINTERNALDESCRIPTION
TE Internal Description
JACK,RTANG,PCB,75 OHM BNC
RFINTERFACE
RF Interface
BNC
RFCONNECTORSTYLE
RF Connector Style
Jack
CONNECTORSYSTEM
Connector System
Cable-to-Board
SEALABLE
Sealable
No
CONNECTORCONTACTTERMINATESTO
Connector & Contact Terminates To
Printed Circuit Board
NUMBEROFPOSITIONS
Number of Positions
1
PCBMOUNTORIENTATION
PCB Mount Orientation
Right Angle
NUMBEROFCOAXIALCONTACTS
Number of Coaxial Contacts
1
IMPEDANCEOHM
Impedance
75 Ohm
BODYMATERIAL
Body Material
Zinc
BODYPLATINGMATERIAL
Body Plating Material
Nickel
BODYSHAPE
Body Shape
Circular
BODYINSULATION
Body Insulation
Without
RFCONNECTORCENTERCONTACTPLATINGMATERIAL
RF Connector Center Contact Plating Material
Gold
RFCONNECTORCENTERCONTACTMATERIAL
RF Connector Center Contact Material
Beryllium Copper
RFCONNECTORCENTERCONTACTPLATINGTHICKNESSUIN
RF Connector Center Contact Plating Thickness
50 uin
TERMINATIONMETHODTOPRINTEDCIRCUITBOARD
Termination Method to Printed Circuit Board
Through Hole - Solder
TERMINATIONPOSTTAILLENGTH
Termination Post & Tail Length
3.33 mm [ .131 in ]
PCBMOUNTRETENTION
PCB Mount Retention
Without
RFCONNECTORCOUPLINGMECHANISM
RF Connector Coupling Mechanism
Bayonet
CONNECTORMOUNTINGTYPE
Connector Mounting Type
Board Mount
RFCONTACTCAPTIVATIONMETHOD
RF Contact Captivation Method
Mechanical
DETENT
Detent
With
RFCONNECTORMATEDOUTERDIAMETERAPPROXIMATE
RF Connector Mated Outer Diameter
14.529 mm [ .572 in ] Approximate
HEIGHTABOVEPCBOARD
Height Above PC Board
10.97 mm [ .432 in ]
OPERATINGTEMPERATURERANGE
Operating Temperature Range
-55 - 85 C [ -67 - 185 F ]
OPERATINGFREQUENCYGHZ
Operating Frequency
2 GHz
PACKAGINGMETHOD
Packaging Method
Carton
DIELECTRICMATERIAL
Dielectric Material
PTFE
GRADE
Grade
Commercial
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