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Company
TE Connectivity
Description
QSFP/QSFP+/zQSFP+
Bill of material
2327362-2
PN
Part Number
CTEPS
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FSCPBN
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DESC
Description
FF
Form Factor
PT
Product Type
PAT
Pluggable I/O Accessory Type
IHS
Included Heat Sink
CT
Cage Type
CS
Connector System
SEALABLE
Sealable
CCTT
Connector & Contact Terminates To
PMC
Port Matrix Configuration
NOP
Number of Ports
NP
Number of Positions
REONPC
Rear EONs per Port Column
LC
Lightpipe Configuration
DR
Data Rate (Max)
Gb/s
HSS
Heat Sink Style
HSHC
Heat Sink Height Class
HSHMM
Heat Sink Height
mm
HSHIN
Heat Sink Height
in
HSF
Heat Sink Finish
PCBCTAPM
PCB Contact Termination Area Plating Material
CUM
Contact Underplating Material
CCR
Contact Current Rating (Max)
A
CMAPTM
Contact Mating Area Plating Thickness
µm
CMAPTIN
Contact Mating Area Plating Thickness
µin
CMAPM
Contact Mating Area Plating Material
TMPCB
Termination Method to Printed Circuit Board
CMT
Connector Mounting Type
CM
Cage Material
CPMM
Centerline (Pitch)
mm
CPIN
Centerline (Pitch)
in
PCBTMM
PCB Thickness (Recommended)
mm
PCBTIN
PCB Thickness (Recommended)
in
TLMM
Tail Length
mm
TLIN
Tail Length
in
OTRC
Operating Temperature Range
°C
OTRF
Operating Temperature Range
°F
FUWPP
For Use With Pluggable I/O Products
PIOA
Pluggable I/O Applications
CA
Circuit Application
HSC
Heat Sink Compatible
ULFR
UL Flammability Rating
PM
Packaging Method
ECFT
EMI Containment Feature Type
IL
Included Lightpipe
ENHANCEMENTS
Enhancements
Additional Information
Recommendations
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Additional Data
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