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Company	TE Connectivity
Description	Mini DIMM Sockets
Bill of material	1-1735438-1
PN Part Number	1-1735438-1 1-1735438-1
CTEPS Contact TE Product Support	CLICK HERE to Contact TE Product Support
FSCPBN Find Specs, Compatible Parts, or Buy Now	CLICK HERE to Find Specs, Compatible Parts, or Buy Now
DESC Description	MiniDIMM,R/A,1.8V,DDR2,RVS,15Au/AuFl MiniDIMM,R/A,1.8V,DDR2,RVS,15Au/AuFl
DRAMT DRAM Type	Double Data Rate (DDR) 3
CS Connector System	Board-to-Board
RRSMM Row-to-Row Spacing	8.7	mm
RRSIN Row-to-Row Spacing	.343	in
CCTT Connector & Contact Terminates To	Printed Circuit Board
PROFILE Profile	Standard
PT Product Type	Socket
CP Center Post	With
NP Number of Positions	244
MO Module Orientation	Right Angle
NR Number of Rows	2
NHD Number of Hold-Downs	6
KEYING Keying	Standard
NK Number of Keys	1
CK Center Key	None
DRAMVV DRAM Voltage	1.5	V
ET Ejector Type	Standard
HDM Hold-Down Material	Copper Alloy
RPL Retention Post Location	None
CPM Center Post Material	Liquid Crystal Polymer (LCP)
LC Latch Color	Natural
MKT Module Key Type	Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
LM Latch Material	Liquid Crystal Polymer (LCP)
EL Ejector Location	Both Ends
EM Ejector Material	Liquid Crystal Polymer (LCP)
EMC Ejector Material Color	Natural
CBM Contact Base Material	Copper Alloy
PCBCTAPM PCB Contact Termination Area Plating Material	Gold Flash
CUM Contact Underplating Material	Nickel
CCR Contact Current Rating (Max)	1	A
ST Socket Type	Memory Card
CMAPTIN Contact Mating Area Plating Thickness	30	µin
SS Socket Style	Mini DIMM
CMAPM Contact Mating Area Plating Material	Gold
IS Insertion Style	Direct Insert
PCBMRT PCB Mount Retention Type	Solder Peg
PCBMR PCB Mount Retention	With
LP Locating Posts	With
PCBMS PCB Mounting Style	Surface Mount
CMT Connector Mounting Type	Board Mount
CPMM Centerline (Pitch)	.6	mm
CPIN Centerline (Pitch)	.024	in
HDPM Hold-Down Plating Material	Tin
HC Housing Color	Black
HM Housing Material	LCP (Liquid Crystal Polymer)
HABMM Height Above PC Board	9.79	mm
HABIN Height Above PC Board	.385	in
CRHDMM Center Retention Hole Diameter	2.5	mm
CRHDIN Center Retention Hole Diameter	.098	in
OTRC Operating Temperature Range	-55 – 125	°C
OTRF Operating Temperature Range	-67 – 257	°F
CA Circuit Application	Power & Signal
ULFR UL Flammability Rating	UL 94V-0
PQ Packaging Quantity	15
PM Packaging Method	Hard Tray, Tray

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1-1735438-1