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Company
TE Connectivity
Description
DIMM Sockets
Bill of material
5-2199154-8
PN
Part Number
CTEPS
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FSCPBN
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DESC
Description
DRAMT
DRAM Type
CS
Connector System
RRSMM
Row-to-Row Spacing
mm
RRSIN
Row-to-Row Spacing
in
SEALABLE
Sealable
CCTT
Connector & Contact Terminates To
CP
Center Post
PROFILE
Profile
PT
Product Type
NP
Number of Positions
MO
Module Orientation
°
NOB
Number of Bays
NR
Number of Rows
KEYING
Keying
NK
Number of Keys
CK
Center Key
DRAMVV
DRAM Voltage
V
ET
Ejector Type
RPL
Retention Post Location
LC
Latch Color
MKT
Module Key Type
LPM
Latch Plating Material
LM
Latch Material
EL
Ejector Location
EM
Ejector Material
RPM
Retention Post Material
EMC
Ejector Material Color
CBM
Contact Base Material
PCBCTAPM
PCB Contact Termination Area Plating Material
CUM
Contact Underplating Material
CCR
Contact Current Rating (Max)
A
ST
Socket Type
SS
Socket Style
STCPTM
Solder Tail Contact Plating Thickness
µm
STCPTIN
Solder Tail Contact Plating Thickness
µin
CMAPTM
Contact Mating Area Plating Thickness
µm
CMAPTIN
Contact Mating Area Plating Thickness
µin
CMAPM
Contact Mating Area Plating Material
IS
Insertion Style
TPLMM
Termination Post Length
mm
TPLIN
Termination Post Length
in
PCBMRT
PCB Mount Retention Type
PCBMR
PCB Mount Retention
PCBMS
PCB Mounting Style
CMT
Connector Mounting Type
POLARIZATION
Polarization
LP
Locating Posts
MA
Mounting Angle
BM
Boardlock Material
CPMM
Centerline (Pitch)
mm
CPIN
Centerline (Pitch)
in
HC
Housing Color
HM
Housing Material
HABMM
Height Above PC Board
mm
HABIN
Height Above PC Board
in
CRHDMM
Center Retention Hole Diameter
mm
CRHDIN
Center Retention Hole Diameter
in
OTRC
Operating Temperature Range
°C
OTRF
Operating Temperature Range
°F
CA
Circuit Application
ULFR
UL Flammability Rating
PM
Packaging Method
PQ
Packaging Quantity
Additional Information
Recommendations
Similar parts
Related Equipment
Additional Data
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